Elmos: Verkauf der Waferfertigung in Dortmund an die MEMS-Foundry Silex Microsystems AB
Die Elmos Semiconductor SE (FSE: ELG) und Silex Microsystems AB (Silex), eine weltweit führende MEMS-Foundry, haben heut…
![fncls[1].jpg](https://cdn.pressebox.de/r/3289ecf95d33a27b/attachments/12/74/85/thumbnail_1274856_552x345.webp)
Viable Zelldichte Messung in Echtzeit für die Überwachung von Bioprozessen
Die Hamilton Bonaduz AG präsentiert mit „ArcAir Data Modeling“ eine neue Software-Lösung, welche die Messwerte von Hamil…
Dieunschlagbare Kombination von Präzision undGeschwindigkeit
Geschwindigkeit oder Präzision. Zwischen diesen beiden Parametern müssen sich Elektronikfertiger aktuell noch entscheide…
Neue Ära der Mikrosystemtechnik proklamiert
Vom 8. bis 10. November 2021 fand in Ludwigsburg der diesjährige Mikrosystemtechnik-Kongress statt als gemeinsame Verans…
Ultrasonic Bonding
Ultrasonic / thermosonic bonding is a process primarily used for bond wires but also for flip chip bonding. Ultrasonic allows to generate a mechanically and electrically stable connection.
Adhesive Technologies
Between two bond partners, adhesive materials can be applied in various ways: dispensing, stencil printing, pin transfer or as a film working as an intermediate connection.
RFID Assembly
RFID chips (Radio Frequency Identification) are increasingly used in industrial and consumer products. They come in sizes from several millimeters down to a few microns, with very thin and flexible substrates prone to thermal stress.
Focal Plane Array / IR Sensor Assembly
A Focal Plane Array (FPA) is a sensor with a two-dimensional detector pixel matrix, i.e. for infra-red light or X-rays, positioned in the focal plane of an optical system.
Thermocompression Bonding
Thermocompression bonding is a quick and easy method to reliably connect flip-chips. As the name suggests, this connecting method relies on force and temperature.
Laser Assisted Die Bonding
Finetech's laser-assisted bonding technology is used in C2S and C2W applications with high demands regarding speed, highest accuracy and localized heat input.